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Mei Ansen signed a strategic cooperation agreement with Shuguang Network Technology Co., Ltd. According to Mei Ansen, recently, Mei Ansen and Shuguang Network Technology Co., Ltd. held a strategic cooperation signing ceremony in Chongqing. The two sides reached a strategic cooperation to jointly build smart mine bases and comprehensive solutions. Shuguang Network Technology Co., Ltd. is a holding subsidiary of Zhongke Shuguang (603019).It is reported that NVIDIA has increased its recruitment in China, and it is expected to add 1,000 employees this year. According to people familiar with the matter, NVIDIA has increased its recruitment in China this year to enhance its research ability and focus on new autonomous driving technology. According to sources, the company is expected to have about 4,000 employees in China by the end of this year, compared with about 3,000 at the beginning of this year. As a key part of the expansion, NVIDIA added about 200 employees in Beijing to strengthen a research team engaged in autonomous driving research. One person familiar with the matter said that the company has also expanded its after-sales service and network software development team.Samsung Electronics shares rose 3%.

Nanchang land port "Changsha-Xiamen-Hong Kong Link" rail-sea intermodal train was opened. On the morning of December 12th, two trains loaded with "Made in Jiangxi" drove out of Nanchang land port in turn under the supervision of Ganjiang New District Customs, marking the official opening of the "Changsha-Xiamen-Hong Kong Link" rail-sea intermodal train from Nanchang land port to Xiamen Port, which greatly boosted the construction of modern logistics system in Jiangxi to a new level. Compared with the past, under the new mode of "Changsha-Xiamen-Hong Kong Link", the transportation efficiency of goods destined for Southeast Asia is shortened by 5-7 days, and the transportation cost is reduced by 20%. (CCTV News)Daiwa Capital Market raised the target price of Tesla from $285 to $420.Minister of Finance Lan Foan attended and delivered a speech at the launching ceremony of the China-World Bank Group Global Ecosystem and Transformation Center. On December 8, the Ministry of Finance and the World Bank jointly held the launching ceremony of the China-World Bank Group Global Ecosystem and Transformation Center (hereinafter referred to as the Global Center). Lan Foan, Minister of Finance, delivered an opening speech with Peng Anjie, President of the World Bank, and signed a memorandum on the Global Center and an agreement on the renewal of the China-World Bank Group Partnership Fund. Liao Minyi, Vice Minister of Finance, and Philo, Vice President of the East Asia and Pacific Region of the World Bank, made closing remarks. More than 100 Chinese and foreign representatives from more than 20 embassies and international organizations in China, as well as relevant domestic departments and research institutions attended the event. Lan Foan emphasized that in the past decade, the central government has invested nearly 6 trillion yuan to fully guarantee the construction of beautiful China. The "gold content" of China's ecological environment has improved significantly, and the "green content" of its development has increased significantly. At the same time, China has assumed the responsibility of a big country, demonstrated its role as a big country, and achieved a major transformation from a participant to a leader in global environmental governance. China is willing to take the global center as a bridge, share China's experience in ecological protection and development, and embark on the road of green transformation together with other countries.

The Shanghai and Shenzhen 300 Index rose 1% to 4,029.91 points. The Shenzhen Component Index rose to 1%, the Shanghai Composite Index rose by 0.76% and the Growth Enterprise Market Index rose by 1.77%.Chief Economic Adviser of India: Continuing to support high-quality capital expenditure will be the driving force to maintain India's economic growth.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)